Flexible Electronics News

Heraeus Introduces New Thick Print Copper Paste System

Develops paste system for power electronic applications, reliable alternative to direct bond copper substrates

Author Image

By: DAVID SAVASTANO

Editor, Ink World Magazine

Heraeus Precious Metals announced the introduction of a Thick Print Copper System to its portfolio of products and applications. The thick printing copper conductor paste system has been developed for power electronic applications where excellent reliability, thermal conductivity and robust thermal cycling performance are required. Heraeus’ Thick Print Copper System can be used to create copper circuits from 20 -350 microns thick on both alumina (Al2O3) and aluminum nitride (AlN) substrates....

Continue reading this story and get 24/7 access to Ink World magazine for FREE


Already a subscriber? Sign in

Keep Up With Our Content. Subscribe To Ink World magazine Newsletters